Contract manufacturing of printed circuit boards
The equipment that our production is equipped with is the ASM E-line Solution software and hardware complex, which includes: an ASM DEK E automatic screen printer, two new ASM SIPLACE E components installation machines, the first of which is equipped with the fastest head in the class of medium-series machines СР14, the second – the most versatile 4th generation DLM assembly module. Both ASM Sipalce E machines are equipped with Warp Compensation and Clamping Force Control systems that allow machines to understand board bending and install the component without squeezing paste out from under it. In addition, the system of individual recognition of each component with the ability to learn in real time ensures high build quality, especially when working with large server boards and large animations.
The ASM E-line Solution complex also includes a software package for remote programming and data synchronization between the printer, machines and inspection. Optimization of the program and control over the assembly process allow you to accurately estimate the assembly time of each product and plan the loading of the site, ensuring that the deadlines for assembling orders are strictly observed.
The new line is also equipped with the OMRON VT-S530 3D automatic optical inspection system, which combines 3D-SJI + 3D technologies.
The unit easily identifies displacements and distortions in solder joints, displaced components, as well as IC coplanarity, thus, it is not just a machine with a phase shift, but a unique and the only unit on the market that opens up new opportunities for inspection of manufactured electronic products of any level of complexity.
The commissioning of the new line provides us with a number of opportunities and advantages:
– Increase in production volume by 2.5 times
– Expansion of the range of services due to the ability to work with significantly more complex boards
– Improved build quality
– Reducing changeover times
Specifications
Automatic screen printer:
Registration Accuracy 2.0 CmK @ ±12.5μm, 6 Sigma Paste Accuracy 2.0 CmK @ ±25μm, 6 Sigma
Installers:
Automatic ASM SIPLACE E (SR14)
1. Installation speed, comp. /hour 45 300
2. The range of installed components is from 01005 to 6×6mm
3. PCB size, mm 1200×460
4. Setting accuracy 23 µm at 3σ
Peculiarities:
Min. output pitch 0.25 mm
Min. BGA pitch= 0.4mm
Mounting force control system (programmable force from 1.3 to 4.5 N)
Warp compensation system up to +- 2mm
Automatic SIPLACE E (CP12/PP)
1. Installation speed, comp. /hour 24 300
2. The range of installed components is from 01005 to 45×98mm
3. PCB size, mm 1200×460
4. Setting accuracy 23 µm at 3σ36
– Pressure control system (with the possibility of programming the force from 2.4 to 5 N) for the CP12 head
– Pressure force control system (with the possibility of programming force from 1.3 to 15 N) for the PP head
PP- Warping compensation system up to +- 2mm for head SR12- Warping compensation system up to +- 2mm for PP head
Min. output step 0.3
Min. output width = 0.15
Min. step BGA= 0.25
Min. BGA ball size = 0.14